2000-06 | Application of electrostatic bonding to field emission display vacuum packaging | Lee, DJ; Lee, NY; Jung, SJ; Kim, KS; Lee, YH; Jang, J; Ju, BK |
1999-04 | Biodegradable polymer blends of poly(lactic acid) and starch | Park, JW; Lee, DJ; Yoo, ES; Im, SS; Kim, SH; Kim, YH |
2005-12 | Characterization of the Phase II metabolites of rutaecarpine in rat by liquid chromatography-electrospray ionization-tandem mass spectrometry | Lee, SK; Lee, DW; Jeon, TW; Jin, CH; Kim, GH; Jun, IH; Lee, DJ; Kim, SI; Kim, DH; Jahng, Y; Jeong, TC |
1999-12 | Effects of a hydrophilic surface in anodic bonding | Lee, DJ; Ju, BK; Jang, J; Lee, KB; Oh, MH |
1998-11 | Electrostatic bonding of silicon-to-ITO coated #7059 glass using Li-doped oxide interlayer | Jeong, JW; Ju, BK; Lee, DJ; Lee, YH; Oh, MH; Choi, DJ |
2001-03-20 | Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application | Lee, DJ; Lee, YH; Jang, J; Ju, BK |
2001-03 | Microtunneling sensors for vacuum level evaluation of field emission display devices | Park, HW; Ju, BK; Park, YK; Lee, DJ; Lee, YH; Kim, CJ; Park, JH; Oh, MH |
2001-07 | New plasma display panel packaging technology using electrostatic bonding method | Lee, DJ; Jeong, JW; Kim, YC; Lee, YH; Ju, BK; Cho, TS; Choi, EH; Jang, J |
1999-01 | Novel bonding technology for hermetically sealed silicon micropackage | Lee, DJ; Ju, BK; Choi, WB; Jeong, JW; Lee, YH; Jang, J; Lee, KB; Oh, MH |
1998-11-11 | The analysis of electric properties of thin film composite reverse osmosis membrane with wet impedance method | Lee, DJ; Choi, YK; Lee, SB; Ahn, KH; Min, BR |
2004-05-03 | The vacuum packaging of a flat lamp using thermally grown carbon nano tubes | Lee, DJ; Moon, SI; Lee, YH; Yoo, JE; Park, JH; Jang, J; Ju, BK |
2004-05 | Thin AC-PDP vacuum in-line sealing using direct-joint packaging method | Lee, DJ; Moon, SI; Lee, YH; Ju, BK |
1999 | Vacuum packaging using anodic bonding and emission characteristics of FED | Lee, DJ; Ju, BK; Jeong, JW; Kim, H; Jung, SJ; Jang, J; Oh, MH |