Effects of a hydrophilic surface in anodic bonding

Abstract

This paper presents a study of the anodic bonding technique using a hydrophilic surface. Our method differs from conventional processes in the pre-treatment of the wafer. Hydrophilic surfaces were achieved from dipping in H2O/H2O2/NH4OH solution. The hydrophilic surface has a large number of -OH groups, which can form hydrogen bonds when two wafers are in contact. This induces a higher electrostatic force, because of the decreasing gap between the glass and silicon wafer. We achieved improved properties, such as a wider bonded area and a higher bond strength than those of conventional methods. Also, the fabricated pressure sensors on the 5-inch silicon wafer were bonded to Pyrex #7740 glass of 3 mm thickness. In order to investigate the migration of the sodium ions, the depth profile at the glass surface by secondary-ion mass spectroscopy and the bonding current were compared with that of conventional methods.