| 2018-12-09 | 3D-Stacked CMOS SPAD Image Sensors: Technology and Applications (Invited Review Paper) | Lee, Myung Jae |
| 2018-02-11 | A 256x256 45/65nm 3D-Stacked SPAD-Based Direct TOF Image Sensor for LiDAR Applications With Optical Polar Modulation for up to 18.6dB Interference Suppression | Lee, Myung Jae |
| 2017-12-02 | A Back-Illuminated 3D-Stacked Single-Photon Avalanche Diode in 45nm CMOS Technology | Lee, Myung Jae |
| 2016-10-29 | A Radiation-Tolerant, High Performance SPAD for SiPMs Implemented in CMOS Technology | Lee, Myung Jae |
| 2016-03-22 | A Single-Photon, Time-Resolved Image Sensor for Low-Light-Level Vision | Lee, Myung Jae |
| 2018-09-25 | Backside Illuminated, Three Dimensional Stacked Single Photon Avalanche Diode Technology in 45nm CMOS | Lee, Myung Jae |
| 2018-09-10 | Chip on Chip Bonding Technology for Fine Pitch Connection With Al-Si/TiN Bumps | Lee, Myung Jae |
| 2018-07-02 | CMOS-Based Single-Photon Detectors: Technology and Applications (Invited Paper) | Lee, Myung Jae |
| 2016-09-13 | Evaluation of Resister and Diode Characteristics for Chip on Chip Bonding Using "AlSi/TiN" Bumps and Concave Shape Electrode With ACP | Lee, Myung Jae |
| 2016-01-23 | Evaluation of the Three-Dimensional Mounting of the Integrated Circuit Using ACP | Lee, Myung Jae |
| 2017-08-23 | Guard-ring dependence of noise characteristics for single-photon avalanche diodes in standard CMOS technology | Lee, Myung Jae |
| 2018-12-01 | Optocoupling in CMOS | Lee, Myung Jae |
| 2017-07-26 | Recent Development of Single-Photon Avalanche Diodes in Standard CMOS Technology for LiDAR Applications | Lee, Myung Jae |
| 2018-08-20 | Single-Photon Detectors for Next-Generation Biomedical Applications (Invited Paper) | Lee, Myung Jae |
| 2017-10-21 | Towards 10ps SPTR and Ultra-Low DCR in SiPMs Through the Combination of Microlenses and Photonic Crystals | Lee, Myung Jae |
| 2016-07-27 | Towards 3D Integration of Single-Photon Avalanche Diodes With Standard SOI CMOS Technology | Lee, Myung Jae |
