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Evaluation of Resister and Diode Characteristics for Chip on Chip Bonding Using "AlSi/TiN" Bumps and Concave Shape Electrode With ACP

Authors

Lee, Myung Jae

Issue Date

2016-09-13

Publisher

Japan Society Applied Physics

Citation

Japan Society of Applied Physics Autumn Meeting

URI

https://pubs.kist.re.kr/handle/201004/79579

Appears in Collections:

KIST Conference Paper > 2016

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