Showing results 1 to 15 of 15
Issue Date | Title | Author(s) |
---|---|---|
2016-07-11 | Ag nanoparticles-embedded surface plasmonic InGaN-based solar cells via scattering and localized field enhancement | Shim, Jae-Phil; Choi, Sang-Bae; Kong, Duk-Jo; Seo, Dong-Ju; Kim, Hyung-jun; Lee, Dong-Seon |
2018-01 | Double-gated ultra-thin-body GaAs-on-insulator p-FETs on Si | Shim, Jae-Phil; Kim, Seong Kwang; Kim, Hansung; Ju, Gunwu; Lim, Heejeong; Kim, SangHyeon; Kim, Hyung-jun |
2017-01-23 | Fabrication and characterization of Pt/Al2O3/Y2O3/In0.53Ga0.47As MOSFETs with low interface trap density | Kim, Seong Kwang; Geum, Dae-Myeong; Shim, Jae-Phil; Kim, Chang Zoo; Kim, Hyung-Jun; Song, Jin Dong; Choi, Won Jun; Choi, Sung-Jin; Kim, Dae Hwan; Kim, Sanghyeon; Kim, Dong Myong |
2017-02-06 | Fabrication of a vertically-stacked passive-matrix micro-LED array structure for a dual color display | Kang, Chang-Mo; Kong, Duk-Jo; Shim, Jae-Phil; Kim, Sanghyeon; Choi, Sang-Bae; Lee, Jun-Yeob; Min, Jung-Hong; Seo, Dong-Ju; Choi, Soo-Young; Lee, Dong-Seon |
2017-09 | Fabrication of InGaAs-on-Insulator Substrates Using Direct Wafer-Bonding and Epitaxial Lift-Off Techniques | Kim, Seong Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Kim, Chang Zoo; Kim, Han-Sung; Song, Jin Dong; Choi, Sung-Jin; Kim, Dae Hwan; Choi, Won Jun; Kim, Hyung-Jun; Kim, Dong Myong; Kim, Sanghyeon |
2018-10 | Heat Shunting by Innovative Source/Drain Contact to Enable Monolithic 3D Integration of InGaAs MOSFETs | Kim, SangHyeon; Kim, Seong Kwang; Shin, SangHoon; Han, Jae-Hoom; Grum, Dae-Myeong; Kim, Hyung-jun; Lee, Subin; Kim, Han Sung; Ju, Gunwu; Song, Jin Dong; Alam, Muhammad A.; Shim, Jae-Phil |
2018-05 | Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III-V and Ge Materials | Kim, Sang-Hyeon; Kim, Seong-Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Ju, Gunwu; Kim, Han-Sung; Lim, Hee-Jeong; Lim, Hyeong-Rak; Han, Jae-Hoon; Lee, Subin; Kim, Ho-Sung; Bidenko, Pavlo; Kang, Chang-Mo; Lee, Dong-Seon; Song, Jin-Dong; Choi, Won Jun; Kim, Hyung-Jun |
2017-10 | Heterogeneous Integration toward Monolithic 3D Chip | Kim, SangHyeon; Kim, Seong-Kwang; Shim, Jae-Phil; Geum, Dae-myeong; Ju, Gunwu; Kim, Han Sung; Kim, Hyung-jun; Lim, Hyeong Rak; Han, Jae-Hoon; Kang, ChangMo; Lee, Dong Seon; Song, Jin Dong; Choi, Won Jun; LIM, HEE JEONG |
2019-08 | Highly Stable Self-Aligned Ni-InGaAs and Non-Self-Aligned Mo Contact for Monolithic 3-D Integration of InGaAs MOSFETs | Kim, Sanghyeon; Kim, Seong Kwang; Shin, Sanghoon; Han, Jae-Hoon; Geum, Dae-Myeong; Shim, Jae-Phil; Lee, Subin; Kim, Hansung; Ju, Gunwu; Song, Jin Dong; Alam, M. A.; Kim, Hyung-Jun |
2018-11 | Hybrid Full-Color Inorganic Light-Emitting Diodes Integrated on a Single Wafer Using Selective Area Growth and Adhesive Bonding | Kang, Chang-Mo; Lee, Jun-Yeob; Kong, Duk-Jo; Shim, Jae-Phil; Kim, Sanghyeon; Mun, Seung-Hyun; Choi, Soo-Young; Park, Mun-Do; Kim, James; Lee, Dong-Seon |
2018-05 | Impact of Ground Plane Doping and Bottom-Gate Biasing on Electrical Properties in In0.53Ga0.47As-OI MOSFETs and Donor Wafer Reusability Toward Monolithic 3-D Integration With In0.53Ga0.47As Channel | Kim, Seong Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Kim, Jaewon; Kim, Chang Zoo; Kim, Han-Sung; Song, Jin Dong; Choi, Sung-Jin; Kim, Dae Hwan; Choi, Won Jun; Kim, Hyung-Jun; Kim, Dong Myong; Kim, Sanghyeon |
2018-03 | Low-Temperature Material Stacking of Ultrathin Body Ge (110)-on-Insulator Structure via Wafer Bonding and Epitaxial Liftoff From III-V Templates | Shim, Jae-Phil; Kim, Han-Sung; Ju, Gunwu; Lim, Hyeong-Rak; Kim, Seong Kwang; Han, Jae-Hoon; Kim, Hyung-Jun; Kim, Sang-Hyeon |
2017-09-04 | Monolithic integration of AlGaInP-based red and InGaN-based green LEDs via adhesive bonding for multicolor emission | Kang, Chang-Mo; Kang, Seok-Jin; Mun, Seung-Hyun; Choi, Soo-Young; Min, Jung-Hong; Kim, Sanghyeon; Shim, Jae-Phil; Lee, Dong-Seon |
2016-11-18 | Size-controlled InGaN/GaN nanorod LEDs with an ITO/graphene transparent layer | Shim, Jae-Phil; Seong, Won-Seok; Min, Jung-Hong; Kong, Duk-Jo; Seo, Dong-Ju; Kim, Hyung-jun; Lee, Dong-Seon |
2018-02-01 | Verification of Ge-on-insulator structure for a mid-infrared photonics platform | Kim, SangHyeon; Han, Jae-Hoon; Shim, Jae-Phil; Kim, Hyung-Jun; Choi, Won Jun |