Heterogeneous Integration toward Monolithic 3D Chip

Authors
Kim, SangHyeonKim, Seong-KwangShim, Jae-PhilGeum, Dae-myeongJu, GunwuKim, Han SungKim, Hyung-junLim, Hyeong RakHan, Jae-HoonKang, ChangMoLee, Dong SeonSong, Jin DongChoi, Won JunLIM, HEE JEONG
Issue Date
2017-10
Publisher
IEEE
Citation
IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
ISSN
2573-5926
URI
https://pubs.kist.re.kr/handle/201004/114605
Appears in Collections:
KIST Conference Paper > 2017
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