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Surface instability caused by stress during chemical etching of silicon wafer

Authors

HAN, JUN HYUN; Kim Jae Hyun; Myoung-Woon Moon; HAN, SEUNG HEE; Joost J. Vlassak

Citation

First International Coference on Microelectronics and Plasma Techology

Keywords

silicon wafer; chemical etching; surface instability; KOH; roughness

URI

https://pubs.kist.re.kr/handle/201004/102514

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KIST Conference Paper > Others

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