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Enhancement of adhesion strength between Cu and PoIyimide by PSII treatment

Authors

Hong Ju Hi; HAN, SEUNG HEE; LEE, YEON HEE; Kang-Jin Kim

Citation

제 94회 대한화학회, v.94, pp.141

Keywords

adhesion; PSII; Copper; polyimide

URI

https://pubs.kist.re.kr/handle/201004/104491

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KIST Conference Paper > Others

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