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Characteristics of W-C-N thin film as a new diffusion barrier for Cu interconnection

Authors

Chang Woo Lee; Kim, Yong Tae; Park Ji Ho; Hee Joon Kim

Citation

2005 Korea-Japan joint workshop on advanced semiconductor processes and equipments

Keywords

W-C-N; diffusion barrier

URI

https://pubs.kist.re.kr/handle/201004/104765

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KIST Conference Paper > Others

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