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Effects of process parameters on the adhesion of copper film on polyethylene tetrephthalate(PET) substrate prepared by ECRMOCVD coupled with a periodic DC bias

Authors

Jin Hyun; JEON BUP JU; Dongjin Byun; Lee, Joong Kee

Citation

Mat. Res. Soc. Symp. Proc., v.795, pp.851 - 856

Keywords

Cu film; ECR-MOCVD; DC bias; polymer substrate

URI

https://pubs.kist.re.kr/handle/201004/106055

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KIST Conference Paper > Others

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