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A study on pre-bonding mechanism of Si wafer at HF pre-treatment

Other Titles

HF 전처리시 실리콘 기판의 초기접합 메카니즘에 관한 연구

Authors

강경두; 박진성; 이채봉; Ju Byeong Kwon; 정귀상

Citation

1999 년도 대한전기학회 하계학술대회 논문집, pp.3313 - 3315

Keywords

FEA

URI

https://pubs.kist.re.kr/handle/201004/109106

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KIST Conference Paper > Others

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