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Study on pre-bonding according with HF pre-treatment conditions in Si wafer direct bonding

Other Titles

실리콘기판 직접접합에 있어서 HF 전처리 조건에 따른 초기접합에 관한 연구

Authors

강경두; 박진성; 정수태; Ju Byeong Kwon; 정귀상

Citation

한국전기전자재료학회 '99 춘계학술대회 논문집, pp.370 - 373

URI

https://pubs.kist.re.kr/handle/201004/109274

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KIST Conference Paper > Others

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