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Other Titles

HF 전처리시 Si 기판 직접접합의 초기접합 모델

Authors

Ju Byeong Kwon; 강경두; 박진성; 정수태; 정귀상

Citation

센서학회 종합학술대회, pp.327 - 330

Keywords

wafer bonding

URI

https://pubs.kist.re.kr/handle/201004/109501

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KIST Conference Paper > Others

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