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Modified low-temperature direct bonding method for vacuum microelectronics application

Other Titles

진공마이크로 일렉트로닉스 응용을 위한 수정된 저온 직접 접합법

Authors

Ju Byeong Kwon; 이덕중; 최우범; 장진; LEE YUN HI; 이광배; OH MYUNG HWAN

Citation

대한전기학회 MEMS 연구회 학술발표회 논문집 , 고려대, pp.201 - 208

Keywords

silicon direct bonding; vacuum microelectronics; wafer bonding

URI

https://pubs.kist.re.kr/handle/201004/110852

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KIST Conference Paper > Others

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