KIST Library Institutional Repository

Multi-substrate bonding using anodic bonding method

Other Titles

정전 열 접합을 이용한 multi-substrate bonding

Authors

Ju Byeong Kwon; 이덕중; 최우범; 한정인; 조경인; 이광배; 장진; OH MYUNG HWAN

Citation

센서기술학술대회 논문집 , 서울대, pp.221 - 226

Keywords

MEMS

URI

https://pubs.kist.re.kr/handle/201004/111298

Appears in Collections:

KIST Conference Paper > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML