KIST Library Institutional Repository

Effect of wet-etching process on the gate insulator of metal tip FEA

Other Titles

금속팁 FEA에서 습식 식각 공정이 게이트 절연체에 미치는 영향

Authors

정유호; Ju Byeong Kwon; Jung Jae Hoon; LEE YUN HI; OH MYUNG HWAN; 김철주

Citation

제1회 한국정보디스플레이 학술대회 논문집, KIST, pp.137 - 138

Keywords

FED; wafer bonding; tubeless packaging

URI

https://pubs.kist.re.kr/handle/201004/111328

Appears in Collections:

KIST Conference Paper > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML