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Status and new evaluation method of interfacial oxide between directly-bonded Si wafer pairs

Authors

Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN

Citation

IEEE MEMS '96, San Diego, USA., pp.337 - 342

Keywords

wafer bonding; annealing; elemental semiconductors; etching; interface structure; materials testing; semiconductor-insulator boundaries; silicon; wafer bonding

URI

https://pubs.kist.re.kr/handle/201004/111445

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KIST Conference Paper > Others

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