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반도체용 Interconnect (Al-2Cu) 에서 reliability향상에 대한 열처리의 영향

Authors

HAN JUN HYUN; SHIN MYUNG CHUL

Issue Date

1996-11

Citation

한국분석과학회 학술대회, pp.8

Keywords

semiconductor; interconnect; realiability

URI

https://pubs.kist.re.kr/handle/201004/111491

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KIST Conference Paper > Others

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