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Characteristics of RuOx thin films as a sacrificial diffusion barrier for Cu metallization

Authors

Kim Yong Tae; H. S. Yoon; C. S. Kwon; H. N. Lee; J. Jang; Min Suk-Ki

Citation

한국물리학회 제71회 학술논문발표회

URI

https://pubs.kist.re.kr/handle/201004/112000

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