Competitive 1T-DRAM in 28 nm FDSOI Technology for Low-Power Embedded Memory

Authors
El Dirani, H.Bawedin, M.Lee, K.Parihar, M.Mescot, X.Fonteneau, P.Galy, Ph.Gamiz, F.Kim, Y-T.Ferrari, P.Cristoloveanu, S.
Issue Date
2016-10
Publisher
IEEE
Citation
IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
Abstract
We demonstrate experimentally a capacitorless 1T-DRAM fabricated with 28 nm FDSOI. The Z(2)-FET memory cell features a large current sense margin and long retention time at T = 25 degrees C and 85 degrees C. Systematic measurements show that Z(2)-FET exhibits negligible OFF-state current at low drain/gate bias and is suitable as a low-power embedded memory.
URI
https://pubs.kist.re.kr/handle/201004/114973
Appears in Collections:
KIST Conference Paper > 2016
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