Radial heterostructure and interface effects on thermoelectric transport properties of Bi/Sn and Bi/Sb core/shell nanowires

Authors
Moon, HongjaeKim, JeongminChun, Dong WonHong, SeokkyoonYoon, Young SooLee, Wooyoung
Issue Date
2020-01
Publisher
ELSEVIER
Citation
CURRENT APPLIED PHYSICS, v.20, no.1, pp.43 - 48
Abstract
The thermoelectric transport properties of Bi/Sn and Bi/Sb core/shell (C/S) nanowires grown by the method of on-film formation of nanowires were systematically investigated. The electrical conductivity and Seebeck coefficient of nanowires with different diameters were measured as a function of the temperature. The contribution of Sn and Sb shells to the total transport in the C/S nanowires was determined using analytical fitting based on the parallel combination of the conducive system model. The carrier-interface boundary scattering at the C/S interface was quantitatively evaluated as the sheet resistance. In addition, the effect of hole doping on the transport properties was also observed in the Bi/Sn C/S nanowires.
Keywords
FIGURE-OF-MERITS; THERMAL-CONDUCTIVITY; ELECTRICAL-RESISTIVITY; POWER FACTOR; SILICON; BISMUTH; REDUCTION; STRAIN; FIGURE-OF-MERITS; THERMAL-CONDUCTIVITY; ELECTRICAL-RESISTIVITY; POWER FACTOR; SILICON; BISMUTH; REDUCTION; STRAIN; Core/shell nanowires; On-film formation of nanowires; Heterostructure; Interface; Thermoelectric; Seebeck coefficient
ISSN
1567-1739
URI
https://pubs.kist.re.kr/handle/201004/119139
DOI
10.1016/j.cap.2019.10.007
Appears in Collections:
KIST Article > 2020
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