Thermal analysis of self-heating in saddle MOSFET devices

Authors
Oh, Hyun GonJeong, CherlhyunCho, Il Hwan
Issue Date
2014-02
Publisher
IOP PUBLISHING LTD
Citation
JAPANESE JOURNAL OF APPLIED PHYSICS, v.53, no.2
Abstract
The self-heating effects (SHEs) of saddle metal oxide semiconductor field-effect transistors (MOSFETs) and gate dimensional impacts on thermal characteristics have been investigated on the basis of a realistic thermal conductivity of silicon and other materials. Thermal characteristics were analyzed by thermal resistance of Si channel. Since Si material has larger thermal conductivity than that of silicon dioxide, it is shown that the length of the side gate of saddle MOSFETs determines heat dissipation of Si channel. Side gate of saddle MOSFETs can be one of the important parameter in device optimization. (C) 2014 The Japan Society of Applied Physics
Keywords
MOSFET; self-heating effects; Simulation; saddle structure
ISSN
0021-4922
URI
https://pubs.kist.re.kr/handle/201004/127138
DOI
10.7567/JJAP.53.020303
Appears in Collections:
KIST Article > 2014
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