Improved properties of Pt-HfO2 gate insulator-ZnO semiconductor thin film structure by annealing of ZnO layer

Authors
Na, Kwang DukKim, Jeong HwanPark, Tae JooSong, JaewonHwang, Cheol SeongChoi, Jung-Hae
Issue Date
2010-07-01
Publisher
ELSEVIER SCIENCE SA
Citation
THIN SOLID FILMS, v.518, no.18, pp.5326 - 5330
Abstract
Metal-insulator-semiconductor capacitors were fabricated with sputtered ZnO and atomic layer deposited HfO2 as the semiconductor and gate dielectric layers, respectively. From the capacitance-voltage measurements, it was confirmed that pre-deposition annealing of the sputtered ZnO layer at 300 degrees C in air greatly decreased the interfacial trap density (similar to 2 x 10(12) cm(-2) eV(-1)), X-ray photoelectron spectroscopy showed a decrease in the OH bonds adsorbed on the ZnO surface after pre-deposition annealing, which improved the interface property. A very small capacitance equivalent thickness of 1.3 nm was achieved, which decreased the operation voltage (<5V) of the device significantly. (C) 2010 Elsevier B.V. All rights reserved.
Keywords
OXIDE; TRANSISTORS; DEPOSITION; MOBILITY; OXIDE; TRANSISTORS; DEPOSITION; MOBILITY; Zinc oxide; Hafnium oxide; High-k dielectrics; Oxide semiconductor; Metal-insulator-semiconductor capacitor; Annealing; Sputtering; Atomic layer deposition
ISSN
0040-6090
URI
https://pubs.kist.re.kr/handle/201004/131266
DOI
10.1016/j.tsf.2010.04.004
Appears in Collections:
KIST Article > 2010
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