Effect of carbon black addition on reaction-bonded silicon carbide ceramics

Authors
Kim, JJun, HWSong, HLee, JHLee, HW
Issue Date
2005-03
Publisher
TRANS TECH PUBLICATIONS LTD
Citation
ADVANCED SI-BASED CERAMICS AND COMPOSITES, v.287, pp.189 - 193
Abstract
High strength reaction-bonded silicon carbide ceramics was successfully produced by reducing the amount of residual silicon and the silicon pocket size with carbon black as an additional carbon source. A prototype of wafer carrier was also produced in near-net dimension by planar contact infiltration of molten silicon into a preform joined with six pieces of simple shape by eliminating process shrinkages. Forming shrinkages were decreased to a negligible level by compression molding, while sintering shrinkage was eliminated by reactive infiltration of molten silicon.
Keywords
compression molding; RBSC; reactive infiltration; carbon black; wafer carrier
ISSN
1013-9826
URI
https://pubs.kist.re.kr/handle/201004/136697
DOI
10.4028/www.scientific.net/KEM.287.189
Appears in Collections:
KIST Article > 2005
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