Flip chip bonder for automatic parallel aligning of IR sensor and read out integrated circuits

Other Titles
적외선 센서/ROIC 접합을 위한 자동 평행 배열 방식의 플립 칩 본더
Authors
서상희김진상안세영
Issue Date
2001-09
Publisher
한국센서학회
Citation
센서학회지, v.10, no.5, pp.65 - 70
Keywords
flip chip bonder; 적외선 검출기; ROIC
ISSN
1225-5475
URI
https://pubs.kist.re.kr/handle/201004/140193
Appears in Collections:
KIST Article > 2001
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