Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, YJ | - |
dc.contributor.author | Joo, YC | - |
dc.date.accessioned | 2024-01-21T12:15:15Z | - |
dc.date.available | 2024-01-21T12:15:15Z | - |
dc.date.created | 2021-09-05 | - |
dc.date.issued | 2001-05-25 | - |
dc.identifier.issn | 1359-6462 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/140473 | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | CONFINED METAL LINES | - |
dc.subject | INDUCED FAILURE | - |
dc.subject | INTERCONNECTS | - |
dc.subject | EVOLUTION | - |
dc.subject | RELIABILITY | - |
dc.subject | DEPENDENCE | - |
dc.subject | SIMULATION | - |
dc.title | Electromigration-induced stress interaction between vias and polygranular clusters | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/S1359-6462(01)00674-1 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | SCRIPTA MATERIALIA, v.44, no.10, pp.2497 - 2501 | - |
dc.citation.title | SCRIPTA MATERIALIA | - |
dc.citation.volume | 44 | - |
dc.citation.number | 10 | - |
dc.citation.startPage | 2497 | - |
dc.citation.endPage | 2501 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000169857600020 | - |
dc.identifier.scopusid | 2-s2.0-0035946870 | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | CONFINED METAL LINES | - |
dc.subject.keywordPlus | INDUCED FAILURE | - |
dc.subject.keywordPlus | INTERCONNECTS | - |
dc.subject.keywordPlus | EVOLUTION | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | DEPENDENCE | - |
dc.subject.keywordPlus | SIMULATION | - |
dc.subject.keywordAuthor | electromigration | - |
dc.subject.keywordAuthor | computer simulation | - |
dc.subject.keywordAuthor | interconnects | - |
dc.subject.keywordAuthor | aluminum | - |
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