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dc.contributor.authorPark, YJ-
dc.contributor.authorJoo, YC-
dc.date.accessioned2024-01-21T12:15:15Z-
dc.date.available2024-01-21T12:15:15Z-
dc.date.created2021-09-05-
dc.date.issued2001-05-25-
dc.identifier.issn1359-6462-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/140473-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectCONFINED METAL LINES-
dc.subjectINDUCED FAILURE-
dc.subjectINTERCONNECTS-
dc.subjectEVOLUTION-
dc.subjectRELIABILITY-
dc.subjectDEPENDENCE-
dc.subjectSIMULATION-
dc.titleElectromigration-induced stress interaction between vias and polygranular clusters-
dc.typeArticle-
dc.identifier.doi10.1016/S1359-6462(01)00674-1-
dc.description.journalClass1-
dc.identifier.bibliographicCitationSCRIPTA MATERIALIA, v.44, no.10, pp.2497 - 2501-
dc.citation.titleSCRIPTA MATERIALIA-
dc.citation.volume44-
dc.citation.number10-
dc.citation.startPage2497-
dc.citation.endPage2501-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000169857600020-
dc.identifier.scopusid2-s2.0-0035946870-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.type.docTypeArticle-
dc.subject.keywordPlusCONFINED METAL LINES-
dc.subject.keywordPlusINDUCED FAILURE-
dc.subject.keywordPlusINTERCONNECTS-
dc.subject.keywordPlusEVOLUTION-
dc.subject.keywordPlusRELIABILITY-
dc.subject.keywordPlusDEPENDENCE-
dc.subject.keywordPlusSIMULATION-
dc.subject.keywordAuthorelectromigration-
dc.subject.keywordAuthorcomputer simulation-
dc.subject.keywordAuthorinterconnects-
dc.subject.keywordAuthoraluminum-
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KIST Article > 2001
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