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Electromigration-induced stress interaction between vias and polygranular clusters

Authors

Park, YJ; Joo, YC

Issue Date

2001-05-25

Publisher

PERGAMON-ELSEVIER SCIENCE LTD

Citation

SCRIPTA MATERIALIA, v.44, no.10, pp.2497 - 2501

Keywords

CONFINED METAL LINES; INDUCED FAILURE; INTERCONNECTS; EVOLUTION; RELIABILITY; DEPENDENCE; SIMULATION; CONFINED METAL LINES; INDUCED FAILURE; INTERCONNECTS; EVOLUTION; RELIABILITY; DEPENDENCE; SIMULATION; electromigration; computer simulation; interconnects; aluminum

ISSN

1359-6462

URI

https://pubs.kist.re.kr/handle/201004/140473

DOI

10.1016/S1359-6462(01)00674-1

Appears in Collections:

KIST Article > 2001

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