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Slow crack growth behavior in Si3N4 sintered with Yb2Si2O7 tie-line composition additives

Authors
Choi, HJ; Kim, HJ; Lee, JG; Kim, YW
Issue Date
2001-04
Publisher
ELSEVIER SCI LTD
Citation
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, v.21, no.4, pp.471 - 475
Abstract
Slow crack growth behavior of two gas pressure sintered Si3N4 ceramics with different additives; a Yb2Si2O7 composition and an Al2O3-Y2O3 composition, was investigated by constant stress-rate ("dynamic fatigue") testing at 1400 degreesC. The slow crack growth parameter. n, was 14.7 and 6.3 for Si3N4 With Yb2Si2O7 and Al2O3-Y2O3 compositions, respectively. Superior crack growth resistance of Si3N4 with Yb2Si2O7 composition was due to its higher refractoriness of intergranular glassy films, compared to Si3N4 with Al2O3-Y2O3 composition. (C) 2001 Elsevier Science Ltd. All rights reserved.
Keywords
SILICON-NITRIDE CERAMICS; OXIDATION BEHAVIOR; STRENGTH; SYSTEM; FILMS; SILICON-NITRIDE CERAMICS; OXIDATION BEHAVIOR; STRENGTH; SYSTEM; FILMS; engine components; grain boundaries; Si3N4; sintering additives; thermal properties
ISSN
0955-2219
URI
https://pubs.kist.re.kr/handle/201004/140598
DOI
10.1016/S0955-2219(00)00218-1
Appears in Collections:
KIST Article > 2001
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