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MEMS/FED packaging 기술 동향 (II) : 기판 접합 공정 중심으로

Authors

주병권; 오명환

Issue Date

1999-02

Citation

전자부품 = The Electronic Parts & Components Monthly, pp.130 - 137

Keywords

MEMS

URI

https://pubs.kist.re.kr/handle/201004/142416

Appears in Collections:

KIST Article > Others

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