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Si-Si electrostatic bonding using electron beam-evaporated corning #7740 as an interlayer

Other Titles

전자선 증착된 Corning #7740 interlayer를 이용한 실리콘-실리콘 정전 열 접합

Authors

주병권; 최우범; 이윤희; 정성재; 이남양; 성만영; 오명환

Issue Date

1997-10

Citation

전기학회논문지, v.46, no.10, pp.1562 - 1572

Keywords

MEMS; wafer bonding; interlayer; electrostatic bonding; Si-Si bonding; electron beam-evaporated #7740 interlayer

URI

https://pubs.kist.re.kr/handle/201004/143571

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KIST Article > Others

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