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Effects of post-pattern annealing on electromigration in Al-2Cu interconnects

Other Titles

Al-2Cu interconnects에서 electromigration에 미치는 post-pattern 어닐링의 영향

Authors

한준현; 신명철

Issue Date

1997-01

Citation

대한금속학회지 = J. of the Korean inst. of met. & mater., v.35, no.11, pp.1555 - 1560

Keywords

electromigration; interconnect; annealing

URI

https://pubs.kist.re.kr/handle/201004/144059

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KIST Article > Others

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