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Chemical vapor deposition of copper films : influence of the seeding layers.

Authors

고석근; 윤경렬; 김석; 최두진; 김기환

Issue Date

1996-01

Citation

Mat. res. soc. proc., v.v. 427, pp.225 - ?

URI

https://pubs.kist.re.kr/handle/201004/144671

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KIST Article > Others

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