Thermally-induced atomic mixing at the interface of Cu and polyimide

Authors
고석근최원국송석균Kook D. Pae정형진
Issue Date
1994-01
Publisher
한국진공학회
Citation
한국진공학회지, v.3, no.3, pp.316 - 321
Keywords
copper; polyimide; interface
ISSN
1225-8822
URI
https://pubs.kist.re.kr/handle/201004/145708
Appears in Collections:
KIST Article > Others
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