반도체 칩 재료의 미세파괴기구 해석 및 신뢰성 평가 연구

Authors
Jeong, Jeung hyun
Issue Date
1996-01-01
Citation
대한금속학회, pp.521 - 538
URI
https://pubs.kist.re.kr/handle/201004/85942
Appears in Collections:
KIST Conference Paper > Others
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