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The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization

Authors

Kim, Yong Tae

Issue Date

1995-07-01

Citation

Proc. of the 2nd Korea-China Symp. on Ion Beam Modification of Materials and Thin Film Materials, pp.0

URI

https://pubs.kist.re.kr/handle/201004/85986

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KIST Conference Paper > Others

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