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Wafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si Substrates

Authors

Kim Hyung-jun; Sanghyeon Kim

Publisher

11.6~9, 제주

Citation

International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2016)

Keywords

wafer bonding; III-V; MOSFET; M3D

URI

https://pubs.kist.re.kr/handle/201004/88801

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KIST Conference Paper > Others

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