Comparison of thin film properties of WN diffusion barrier prepared by atomic layer deposition using metal organic and metal halide reactant gases

Authors
Yeonghyeon HwangWon-Ju ChoKim, Yong Tae
Citation
Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD 2012), pp.124 - 127
Keywords
Diffusion barrier; ALD; WN; surface treatment
URI
https://pubs.kist.re.kr/handle/201004/95709
Appears in Collections:
KIST Conference Paper > Others
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