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Thermal stability of Cu/WN/Si nano via contact structures

Authors

Yeong Hyeon Hwang; Won-Ju Cho; Kim, Young-Hwan; Kim, Yong Tae

Citation

Microprocesses and Nanotechnology Conference 2011, pp.p-11-58

Keywords

Cu via; Contact resistance; Thermal stability; WN; Diffusion barrier

URI

https://pubs.kist.re.kr/handle/201004/97237

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KIST Conference Paper > Others

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