Showing results 1 to 6 of 6
Issue Date | Title | Author(s) |
---|---|---|
1987-01 | A study of Au-Ge/Ag/Au ohmic contact on n-type (100) GaAs epi-wafer. | 강광남; 권철순; 최인훈; 김무성; 정지채 |
- | Comparison of amorphous and polycrystalline tungsten nitride diffusion barrier for MOCVD-Cu metallization. | Kim Yong Tae; 권철순; 김동준; 이창우; 최인훈 |
- | Thermal stability of plasma deposited tungsten nitride thin films for VLSI devices. | Kim Yong Tae; 이창우; 권철순 |
1999-05-24 | 반도체 금속박막의 배선방법 | 민석기; 권철순; 김용태 |
- | 질소이온 주입된 질화텅스텐박막의 구리배선용 확산방지막 특성 . | Kim Yong Tae; 권철순; 김동준; Min Suk-Ki |
- | (Undefined) | Kim Yong Tae; 김동준; 박종완; 권철순; Min Suk-Ki |