| - | Electron emission characteristics of the porous polycrystalline silicon diode | Kim Hun; Jong-Won Park; 이주원; LEE YUN HI; 송윤호; Jin-Ho Lee; 조경익; 장진; OH MYUNG HWAN; Ju Byeong Kwon |
| 1998-05 | Electrostatic bonding between Si and ITO-coated #7059 glass substrates | 주병권; 정회환; 김영조; 한정인; 조경익; 오명환 |
| 1998-07 | Electrostatic bonding between two ITO-coated glass for FED tubeless packaging applications | 주병권; 이덕중; 정지원; 이윤희; 이남양; 한정인; 조경익; 오명환 |
| - | Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging | Ju Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN |
| - | Glass-to-glass bonding for tubeless packaging of field emission display | Ju Byeong Kwon; 최우범; 이덕중; 정지원; 정성재; LEE NAM YANG; 조경익; 유형준; 한정인; OH MYUNG HWAN |
| 1998-08 | Improvement of bonding properties by pre-bonding at room temperature in Si-glass electrostatic bonding process | 주병권; 이덕중; 이윤희; 이남양; 한정인; 조경익; 오명환 |
| - | In-situ vacuum packaging method for FEDs in ultra-high-vacuum chamber | 최우범; Ju Byeong Kwon; LEE YUN HI; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 한정인; 조경익; 성만영 |
| - | Technical improvement of FED tubeless packaging | Ju Byeong Kwon; 이덕중; 최우범; 정성재; LEE NAM YANG; 조경익; LEE YUN HI; 성만영; OH MYUNG HWAN |
| - | Vacuum sealing of field-emission arrays using field-assisted bonding method | 이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; LEE NAM YANG; 한정인; 조경익; 장진 |
