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Other Titles

CVD를 이용한 Cu 증착 시 plasma 전처리로 인한 구조적 특성의 비교 분석

Authors

진성언; 변동진; 이승무; Ji Hun Park; 이도한; 최종문; 김창균; 정택모

Citation

한국재료학회

Keywords

Cu; CVD; plasma; agglomeration; seed layer

URI

https://pubs.kist.re.kr/handle/201004/101435

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KIST Conference Paper > Others

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