Effect of structural properties on electrical properties of lanthanum oxide thin film as a gate dielectric
- Authors
- Jun, JH; Choi, DJ; Kim, KH; Oh, KY; Hwang, CJ
- Issue Date
- 2003-06
- Publisher
- INST PURE APPLIED PHYSICS
- Citation
- JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.6A, pp.3519 - 3522
- Abstract
- The electrical properties of lanthanum oxide was grown by using metal organic chemical vapor deposition (MOCVD) were investigated from the change of structural properties which occurred during the post-annealing process. The as-grown film had a dielectric constant of 18.8, and capacitance equivalent oxide thickness of 1.7 nm. The leakage current density of the film was measured as 2.4 x 10(-4) A/cm(2) at -1 MV/cm. When the film was annealed at 900degreesC, the dielectric constant decreased with the increase of the interfacial layer. [DOI: 10.1143/JJAP.42.3519].
- Keywords
- STABILITY; SI(001); DEPOSITION; SILICON; LAYERS; electrical and structural properties; lanthanum oxide; MOCVD; dielectric constant; leakage current density; post-annealing; interfacial layer
- ISSN
- 0021-4922
- URI
- https://pubs.kist.re.kr/handle/201004/138472
- DOI
- 10.1143/JJAP.42.3519
- Appears in Collections:
- KIST Article > 2003
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