Fabrication and field emission properties of poly-diamond films

Authors
Ju, BKLee, YHOh, MH
Issue Date
1998-11
Publisher
ELSEVIER ADVANCED TECHNOLOGY
Citation
MICROELECTRONICS JOURNAL, v.29, no.11, pp.855 - 859
Abstract
By using a substrate transferring technique, poly-diamond thick films having a smooth or rough surface could be fabricated as field emitter materials. The diamond film with a smooth surface, which was transferred from the interface between the (100) Si substrate and poly diamond deposited by plasma-enhanced CVD, showed better field emission properties in terms of emission current density with improved vacuum level dependence as compared with original poly-diamond film from a rough surface. (C) 1998 Elsevier Science Ltd. All rights reserved.
Keywords
field emission; diamond; film
ISSN
0026-2692
URI
https://pubs.kist.re.kr/handle/201004/142787
DOI
10.1016/S0026-2692(98)00018-4
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KIST Article > Others
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