Fabrication and field emission properties of poly-diamond films
- Authors
- Ju, BK; Lee, YH; Oh, MH
- Issue Date
- 1998-11
- Publisher
- ELSEVIER ADVANCED TECHNOLOGY
- Citation
- MICROELECTRONICS JOURNAL, v.29, no.11, pp.855 - 859
- Abstract
- By using a substrate transferring technique, poly-diamond thick films having a smooth or rough surface could be fabricated as field emitter materials. The diamond film with a smooth surface, which was transferred from the interface between the (100) Si substrate and poly diamond deposited by plasma-enhanced CVD, showed better field emission properties in terms of emission current density with improved vacuum level dependence as compared with original poly-diamond film from a rough surface. (C) 1998 Elsevier Science Ltd. All rights reserved.
- Keywords
- field emission; diamond; film
- ISSN
- 0026-2692
- URI
- https://pubs.kist.re.kr/handle/201004/142787
- DOI
- 10.1016/S0026-2692(98)00018-4
- Appears in Collections:
- KIST Article > Others
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