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Development of thermoelectric cooling module

Other Titles

IC package용 cooling module 개발

Authors

현도빈

Issue Date

1997-12

Citation

대한금속학회회보 = Bulletin of the Korean Inst. of Met. & Mat., v.10, no.6, pp.667 - 675

Keywords

Thermoelectrics; Thermoelectric cooling module

URI

https://pubs.kist.re.kr/handle/201004/143478

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KIST Article > Others

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