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A study on low-temperature bonding of glass-silicon using modified direct bonding method

Other Titles

수정된 직접 접합 방법을 이용한 유리-실리콘 기판의 저온 접합에 관한 연구

Authors

주병권; 고창기; 이윤희; 강인병; Paul White; Noel Samaan; Malcolm Haskard; 오명환

Issue Date

1997-03

Citation

전기학회논문지, v.46, no.3, pp.450 - 455

Keywords

MEMS; wafer bonding; glass-Si direct bonding; New and low-temperature bonding method

URI

https://pubs.kist.re.kr/handle/201004/143919

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KIST Article > Others

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