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Design of electrostatic bonding equipment for large area and the effect of contamination particle on the Si-glass electrostatic bonding.

Other Titles

대면적 정전 접합 장치 고안 및 Si과 glass접합에 미치는 불순물의 영향

Authors

문제도; 오재열; 조영래; 정효수; 주병권; 오명환

Issue Date

1996-01

Citation

한국재료학회지 = Korean journal of materials research, v.6, no.1, pp.3 - 11

URI

https://pubs.kist.re.kr/handle/201004/144713

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KIST Article > Others

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