KIST Library Institutional Repository

Copper film growth by chemical vapor deposition.

Other Titles

ICB seeding 에 의한 CVD Cu 박막의 증착 및 특성 분석 =

Authors

윤경렬; 최두진; 김석; 김기환; 고석근

Issue Date

1996-01

Citation

한국재료학회지 = Korean journal of materials research, v.v. 6, no.no. 7, pp.723 - ?

URI

https://pubs.kist.re.kr/handle/201004/144730

Appears in Collections:

KIST Article > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML