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Study on the bonding interface in directly-bonded Si-Si and Si-SiO2/Si wafer pairs

Other Titles

직접 접합된 Si-Si, Si-SiO2/Si 기판쌍의 접합 계면에 관한 연구

Authors

주병권; 방준호; 이윤희; 박종완; 차균현; 오명환

Issue Date

1994-04

Citation

한국재료학회지 = Korean Journal of Materials Research, v.4, no.2, pp.127 - 135

Keywords

micromachining; wafer bonding; bonding interface

ISSN

1225-0562

URI

https://pubs.kist.re.kr/handle/201004/145613

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KIST Article > Others

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