Showing results 1 to 18 of 18
Issue Date | Title | Author(s) |
---|---|---|
- | A study on the fabrication of vertical-walled cavity and direct bonding method | 고창기; Ju Byeong Kwon; LEE YUN HI; 정성재; LEE NAM YANG; 고근하; PARK JEONG HO; OH MYUNG HWAN |
- | Characterization of tubeless packaged FED by glass-to-glass anodic bonding method | D. J. Lee; Ju Byeong Kwon; OH MYUNG HWAN; LEE NAM YANG; 정성재; 김관수; 한정인; J. Jang |
- | Experimental analysis of the process of anodic bonding with an evaporated glass layer | 최우범; Ju Byeong Kwon; LEE YUN HI; S. J. Jeong; M. R. Haskard; LEE NAM YANG; 성만영; OH MYUNG HWAN |
- | Experimental analysis on the anodic bonding with evaporated glass layer | 최우범; Ju Byeong Kwon; LEE YUN HI; 정성재; LEE NAM YANG; 고근하; M. R. Haskard; 성만영; OH MYUNG HWAN |
- | Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging | Ju Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN |
- | Glass-to-glass bonding for tubeless packaging of field emission display | Ju Byeong Kwon; 최우범; 이덕중; 정지원; 정성재; LEE NAM YANG; 조경익; 유형준; 한정인; OH MYUNG HWAN |
- | In-situ vacuum packaging method for FEDs in ultra-high-vacuum chamber | 최우범; Ju Byeong Kwon; LEE YUN HI; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 한정인; 조경익; 성만영 |
- | New Vacuum packaging method of field emission display | Ju Byeong Kwon; 최우범; S. J. Jeong; LEE NAM YANG; J. I. Han; K. I. Cho; OH MYUNG HWAN |
- | Silicon to silicon anodic bonding using lithium doped interlayer | 정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN |
- | Small graphic white-light emitting ZnS:Pr,Ce TFEL displays | LEE YUN HI; KIM YOUNG SIK; Ju Byeong Kwon; 정성재; LEE NAM YANG; OH MYUNG HWAN |
- | Technical improvement of FED tubeless packaging | Ju Byeong Kwon; 이덕중; 최우범; 정성재; LEE NAM YANG; 조경익; LEE YUN HI; 성만영; OH MYUNG HWAN |
- | Vacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structure | Ju Byeong Kwon; 이덕중; 정지원; Kim Hun; 이상조; LEE NAM YANG; 장진; OH MYUNG HWAN |
- | Vacuum sealing of field-emission arrays using field-assisted bonding method | 이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; LEE NAM YANG; 한정인; 조경익; 장진 |
- | 전자선 증착된 실리콘 산화막 층을 이용한 직접 접합에 관한 연구 . | Ju Byeong Kwon; 박흥우; LEE YUN HI; 정성재; LEE NAM YANG; 고근하; M.R. Haskard; PARK JEONG HO; OH MYUNG HWAN |
- | (Undefined) | Ju Byeong Kwon; OH MYUNG HWAN; Jung Jae Hoon; 고창기; LEE NAM YANG; 김철주; 장진 |
- | (Undefined) | 고창기; Ju Byeong Kwon; 박흥우; Jung Jae Hoon; LEE NAM YANG; OH MYUNG HWAN; 김철주 |
- | (Undefined) | Ju Byeong Kwon; OH MYUNG HWAN; Jung Jae Hoon; 고창기; LEE NAM YANG; 김철주; 장진 |
- | (Undefined) | Jung Jae Hoon; Ju Byeong Kwon; 고창기; 박흥우; LEE NAM YANG; 장진; OH MYUNG HWAN |