| 2002-01 | AlN piezoelectric materials for wireless communication thin film components | Kim, JH; Lee, SH; Ahn, JH; Lee, JK |
| - | Design and fabrication of film bulk acoustic wave resonator | KIM IN TAY; 박윤권; 김용국; LEE YUN HI; Lee Jeon Kook; 김남수; Ju Byeong Kwon |
| - | Fabrication of flexible FBAR using thin silicon wafer. | 김용국; 배용환; 강유리; Kim Jai Kyeong; KIM SOO WON; Ju Byeong Kwon |
| - | Film bulk acoustic wave resonator using surface micromachining. | KIM IN TAY; 박윤권; 이시형; 이수현; LEE YUN HI; Lee Jeon Kook; 김남수; Ju Byeong Kwon |
| 2003-12 | Flexible 마이크로시스템을 위한 압전 박막 공진기의 설계 및 제작 | 강유리; 김용국; 김수원; 주병권 |
| 2002-08 | High frequency response of Bragg reflector type film bulk acoustic wave resonator | Kim, JH; Lee, SH; Ahn, JH; Lee, JK |
| - | Influence of electrodes and bragg reflector on the quality of thin film bulk acoustic wave resonators | 이시형; 김주형; G. D. Mansfeld; 윤기현; Lee Jeon Kook |
| - | Monolithic film bulk acoustic wave resonator using SOI wafer | KIM IN TAY; 박윤권; 이시형; LEE YUN HI; Lee Jeon Kook; 김남수; Ju Byeong Kwon |
| 2002-12 | Monolithic film bulk acoustic wave resonator using SOI wafer | 김인태; 박윤권; 이시형; 이윤희; 이전국; 김남수; 주병권 |
| - | Packaging of the MEMS devices using thin silicon wafer | 박윤권; 김용국; Kim Hun; LEE YUN HI; 김철주; Ju Byeong Kwon |
| - | SOI 웨이퍼를 이용한 압전박막 공진기의 설계 및 제작 | KIM IN TAY; 박윤권; 이시형; LEE YUN HI; Lee Jeon Kook; 김남수; Ju Byeong Kwon |
